Can you please provide me some information regarding this tool that you use
for bonding? Like, what is the name of the tool, etc?

Thank You very much for your help!

On Tue, Jan 17, 2012 at 4:39 PM, Andrew Sarangan wrote:

> What you need is a wafer bonding tool, which can easily produce these
> range of forces and temperatures. Also, bonding in vacuum may be
> necessary to eliminate trapped air at the interface. I have one of
> these in my lab if you need further information.
>


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Best Regards
Ankita Verma